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Manufacturing Challenges in Electronic Packaging

by Y. C. Lee

Cover of Manufacturing Challenges in Electronic Packaging

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

EngineeringMachineryElectronic packagingManufacturing processes