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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

by Ephraim Suhir

Cover of Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

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Interconnects (Integrated circuit technology)ProtectionSolder and solderingMechanical propertiesMathematical modelsFailure analysis (Engineering)Equipment Failure AnalysisInterconnexions (Technologie des circuits intégrés)SoudurePropriétés mécaniquesModèles mathématiquesAnalyse des défaillances (Ingénierie)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by Ephraim Suhir — book · Vinony