Application of Fracture Mechanics in Electronic Packaging and Materials

Name: Application of Fracture Mechanics in Electronic Packaging and Materials
Author: Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta

by Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta

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CongressesFracture mechanicsElectronic packagingMechanical engineering

Application of Fracture Mechanics in Electronic Packaging and Materials by Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta — book · Vinony