Category

Chip carriers

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surface-mount technology

method for producing electronic circuits

dual in-line package

type of electronic component package

through-hole technology

mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side manually or by automated insertion mount machines

type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package

ball grid array

type of surface-mount packaging

Quad Flat Package

surface mount integrated circuit package

land grid array

type of surface-mount packaging for integrated circuits

surface mount technology package for integrated circuits

integrated circuit packaging

final stage of semiconductor device fabrication

technique that flips a microchip upside down to connect it

multi-chip module

discrete electronic assembly containing multiple integrated circuits that behaves as a unit

small-outline integrated circuit

a type of surface-mounted integrated circuit (IC) package

low insertion force

technology used in integrated circuit sockets

Thin small-outline package

type of surface mount IC package

package on a package

integrated circuit packaging method

wafer-level packaging

technology of packaging an integrated circuit while still part of the wafer

Quad Flat No-leads package

Integrated circuit package with contacts on all 4 sides, on the underside of the package

Chip scale package

Integrated circuit package that is no or barely larger than the integrated circuit it contains

Universal Integrated Circuit Card

Zig-zag in-line package

type of electronic packaging

sheet metal frame to support the die/chip and allow interconnection in an electronic device

Solid Logic Technology

transistor circuit technology used in IBM System/360

integrated circuit packaging type

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