wafer-level packaging
Sign in to saveAlso known as WCSP, WLP
technology of packaging an integrated circuit while still part of the wafer
In the Vinony graph
Vinony's link graph records 68 inbound references to wafer-level packaging, and connects out to dual in-line package, integrated circuit packaging and International Standard Book Number.
It is catalogued under topics including Chip carriers, Electronics manufacturing and Semiconductor technology.
Vinony links it to 7 Wikipedia language editions.
Wikidata facts
- Subclass of
- system in package
- Image
- Samsung Galaxy Tab 2 10.1 - Texas Instruments TWL6032-3960.jpg
Show 1 more fact
- Commons category
- WCSP integrated circuit packages
Sources (2)
via Wikidata · CC0