In the Vinony graph
Vinony's link graph records 141 inbound references to 平面网格阵列封装, and connects out to surface-mount technology, Intel Core and dual in-line package.
It is catalogued under the topic Chip carriers.
Vinony links it to 17 Wikipedia language editions.
Wikidata facts
- Subclass of
- electrical connector
- Part of
- surface-mount technology
- Image
- Socket 1151 closed 01.jpg
Show 2 more facts
- Commons category
- LGA integrated circuit packages
- opposite of
- pin grid array
Sources (1)
via Wikidata · CC0
Article · 中文
平面網格陣列封裝（英語：LGA, Land grid array）是一種積體電路的表面安装技术。其特點在於其針腳是位於插座上而非積體電路上。LGA封裝的晶片能被連接到印刷電路板（PCB）上或直接焊接至電路板上。與傳統針腳在積體電路上的封裝方式相比，可減少針腳損壞的問題並可增加腳位。
Abstract from DBpedia / Wikipedia · CC BY-SA
Connections
surface-mount technology
Entity
Intel Core
Entity
dual in-line package
Entity
Skylake
Entity
LGA 2011-0
Entity
Kaby Lake
Entity
chip carrier
Entity
diode
Entity
central processing unit
Entity
motherboard
Entity
Intel
Company
integrated circuit
Entity
Hewlett-Packard
Company
AMD
Company
Sun Microsystems
Entity
printed circuit board
Entity
soldering or brazing
Entity
workstation
Entity
Pentium
Entity
Pentium 4
Entity