Packaging (microfabrication)

technique used to connect a microchip to its package

final stage of semiconductor device fabrication

group of a number of integrated circuits enclosed in a single module (a package)

integrated circuit packaging method

integrated circuit with vertical interconnections

Integrated circuit package made out of fired ceramic material

packaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulation

connection method for surface-mounted chips