EntityQ677010· pop 7· linked from 27 articleswafer bondingSign in to savepackaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulationConnectionsInternational Standard Book NumberEntitydigital object identifierEntityintegrated circuitEntitymicroelectronicsEntityoptoelectronicsEntitymicro-electromechanical systemsEntitysemiconductor waferEntitynanoelectromechanical systemEntityWire bondingEntitytape-automated bondingEntityThermocompression bondingEntityCategoriesChemical bondingElectronics manufacturingPackaging (microfabrication)Semiconductor technologyWafer bonding