Wire bonding
Sign in to savetechnique used to connect a microchip to its package
Described at
Кудряшов.indd
eurointech.ru →Link to a page describing this subject · 19,971 chars · not written by Vinony
Wikidata facts
- Instance of
- soldering or brazing
- Subclass of
- production process
- Image
- CRP INDUSTRIES 2N2222.jpg
- Has use
- semiconductor device
Show 3 more facts
- described at URL
- eurointech.ru/products/TPT/TPT_technology.pdf
- uses
- compression
- Commons category
- Wire bonding
Sources (3)
via Wikidata · CC0