Printed circuit board manufacturing

board to support and connect electronic components

circuit board able to be connected to a computer system to add functionality

mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side manually or by automated insertion mount machines

JTAG (named after the Joint Test Action Group which codified it) is an industry standard for verifying designs of and testing printed circuit boards after manufacture.

thumb|right|200px|Cross-section of microstrip geometry. Conductor A is separated from ground plane D by dielectric substrate C. Upper dielectric B is typically air.

FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many applications.

connection between layers in an electronic circuit board

connector formed by electrical conductors on the edge of a printed circuit board

Electronics soldering process

electronics soldering process

thumb|right|Solders can be removed using a vacuum plunger (on the right) and a soldering iron. In electronics, desoldering is the removal of soldered components from a circuit board for troubleshooting, repair, replacement, and salvage. Desoldering involves breaking the soldered connection between component and board, typically by reflowing and removing the solder, allowing the component to be removed and potentially replaced if needed.

FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material. FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing).

Circuit board allowing attachment of expansion cards to a computer system with low profile

robotic machine that places surface-mount electronic components (SMDs) onto printed circuit boards

method of manufacturing where integrated circuits are wired and bonded directly to a printed circuit board

chemical induced Nickel coating of a surface

layer of polymer applied to printed circuit boards

testing method on printed circuit boards

industrial process in electronics

organization

AT&S also known as AT & S Austria Technologie & Systemtechnik Aktiengesellschaft designs and manufactures high-end printed circuit boards and IC substrates (Integrated circuit) for semiconductors. The company is listed on the Vienna Stock Exchange since 2008.

transmission line with a flat, ribbon-shaped conductor

the designated surface area for an electrical contact

method of testing electronic circuits

Systems that use image processing methods to find and report defects in production and other goods

transistor circuit technology used in IBM System/360

description language for electronics testing

Plating process

American physicist and chemist (1909-1985)