through-silicon via
Sign in to saveAlso known as through silicon via, TSV
metal-plated holes used to vertically electrically connect several dies that are atop each other
In the Vinony graph
Vinony's link graph records 30 inbound references to through-silicon via, and connects out to dynamic random-access memory, three-dimensional integrated circuit and International Standard Book Number.
It is catalogued under topics including Integrated circuits and Semiconductor device fabrication.
Vinony links it to 10 Wikipedia language editions.
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dynamic random-access memory
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three-dimensional integrated circuit
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International Standard Book Number
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transistor
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capacitor
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resistor
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IBM
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random-access memory
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digital object identifier
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integrated circuit
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byte
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William Shockley
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microprocessor
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Nvidia
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Siemens
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Toshiba
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mechanical stress
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bibcode
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arXiv
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Hitachi
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