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리드 프레임 · Vinony

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리드 프레임

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EntityQ16466835· pop 7· linked from 17 articles

리드 프레임

sheet metal frame to support the die/chip and allow interconnection in an electronic device

Wikidata facts

Image: TQFP Leadframe.jpg

Sources (4)

wikidata.org
docs.openalex.org
web.archive.org
zpp12.ru

via Wikidata · CC0

Available in 6 languages

Deutsch
中文
Русский
فارسی
한국어

via Wikidata sitelinks · CC0

Connections

dual in-line package

Categories

Sources

wikipedia.externallinksexternallink

International Standard Book Number

Entity

printed circuit board

voltage regulator

semiconductor device

semiconductor wafer

surface-mount technology

through-hole technology

ball grid array

land grid array

Quad Flat Package

integrated circuit packaging

small-outline integrated circuit

semiconductor package

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What links here17 pages

Restriction of Hazardous Substances Directive

tape-automated bonding

integrated circuit packaging

Quad Flat No-leads package

dual in-line package

semiconductor device fabrication

Similar entities

Discovered by embedding cosine similarity (sentence-transformers MiniLM, 384-dim).

Molded interconnect device

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front end of line

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hollow structural section

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zero-insertion-force connector

Entitydist 0.58

networking hardware

Entitydist 0.58

Power electronic substrate

Entitydist 0.59

Entitydist 0.60

Microchip Technology

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low insertion force

Entitydist 0.61

Interorbital Systems

Companydist 0.61