多晶片模組
Sign in to saveAlso known as MCM, multichip module, multi-chip package, multichip package
discrete electronic assembly containing multiple integrated circuits that behaves as a unit
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Vinony's link graph records 320 inbound references to 多晶片模組, and connects out to graphics processing unit, system on a chip and Universal Flash Storage.
It sits within the topics Chip carriers and Modularity.
Vinony links it to 11 Wikipedia language editions.
Wikidata facts
- Instance of
- integrated circuit packaging type
- Subclass of
- component
- Has part
- chiplet
- Image
- AMD@7nm(12nmIO)@Zen2@Matisse@Ryzen 5 3600@100-000000031 BF 1923SUT 9HM6935R90062 [email protected]
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- Commons category
- Multi-chip modules
Sources (2)
via Wikidata · CC0
Article · 中文
多晶片模組，簡稱MCM（Multi-Chip Module），是一種裸晶（die）、晶片、積體電路的包裝、封裝技術（Package），此種封裝技術能在一個封裝內容納兩個或兩個以上的裸晶，而在此技術未發創前，一個封裝內多半只有一個裸晶。 MCM依據製造方式的不同而有不同的類型，差別主要在於（High Density Inteconnection；HDI）基板（Substrate）的形成方式： * MCM-L（Laminated MCM）層壓式MCM，基板部分用多層的薄型印刷電路板（Printed Circuit Board；PCB）所構成。 * MCM-D（Deposited MCM）堆積式MCM，將多片使用薄膜技術製成的基板加以疊堆而成。 * MCM-C（Ceramic Substrate MCM）陶瓷基板式MCM。
Abstract from DBpedia / Wikipedia · CC BY-SA