TO-3

thumb|Size comparison of Bipolar junction transistor|BJT transistor packages, from left to right: [[SOT-23, TO-92, TO-126, TO-3]] thumb|3D model of TO-3 package In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of technical drawings produced by JEDEC.

Described at

Restricted Content | JEDEC

jedec.org →

Link to a page describing this subject · 1,201 chars · not written by Vinony

Wikidata facts

Image: 2N3055 NPN Transistor.jpg

Show 2 more facts

Commons category: TO-3 transistor packages
described at URL: www.jedec.org/sites/default/files/docs/archive/to/to-003.pdf

Sources (1)

wikidata.org

via Wikidata · CC0

~6 min read

Article

11 sections

Contents

Typical applications
Construction
Dimensions
Variants
TO-41
TO-204
National standards
Common components in a TO-3 package
See also
References
External links

The TO-3 case has a flat surface which can be attached to a heatsink, normally via a thermally conductive but electrically insulating washer. The design originated at Motorola around 1955 from a group headed by Dr. Virgil E. Bottom. who was director of research of the Motorola Semiconductor Division. The first use of this design was for the germanium alloy-junction power transistor 2N176 – the first power transistor to be put into quantity production. The lead spacing was originally intended to allow plugging the device into a then-common tube socket.