Electronics manufacturing

board to support and connect electronic components

thumb|upright=1.5|Using a soldering iron to desolder a contact from a wire

method for producing electronic circuits

JTAG (named after the Joint Test Action Group which codified it) is an industry standard for verifying designs of and testing printed circuit boards after manufacture.

circuit board assembly technique

Jabil Inc. is an American multinational manufacturing company involved in the design, engineering, and manufacturing of electronic circuit board assemblies and systems, along with supply chain services, primarily serving original equipment manufacturers. It is headquartered in the Gateway area of St. Petersburg, Florida. It is one of the largest companies in the Tampa Bay area.

technique used to connect a microchip to its package

set of printing methods used to create electrical devices on various substrates

connection between layers in an electronic circuit board

thumb|200 px|Mordant red 19 is a typical mordant dye. Like many mordant dyes, it features the [[azo group (RN=NR) and various sites for chelating to metal cations.]] thumb|A French Indienne, a printed or painted textile in the manner of Indian productions, which used mordants to fix the dyes

file format

process of coating an object with a thin adherent layer of gold

act of making electronic components and systems resistant to damage or malfunctions caused by ionizing radiation (particle radiation and high-energy electromagnetic radiation)

repair, testing, and distribution of electrical and electronic products

Method for assembling electrical components

field in manufacturing

technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates

countinous printing method that prints directly onto a roll of fabric or other materials

method of manufacturing where integrated circuits are wired and bonded directly to a printed circuit board

testing method on printed circuit boards

Electronics company

secondary manufacturer of electronic components

Integrated circuit package made out of fired ceramic material

transistor type used in the flat-panel display industry

technology of packaging an integrated circuit while still part of the wafer

packaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulation

1st part of IC fabrication that patterns individual devices in the semiconductor

the 2nd portion of IC fabrication where the individual devices are connected with wiring on the wafer

light-emitting diode in a surface-mount package

synthetic rectangular electromagnetic waveguide

Pattern used in circuit board production

description language for electronics testing

location within an electronic circuit that can be used to monitor the state of the circuitry or inject test signals

Technical blueprints intended for free copying by others