surface mount integrated circuit package
In the Vinony graph
Within Vinony's link graph, QFP is referenced by 121 other articles, and connects out to dual in-line package, surface-mount technology and through-hole technology.
It is catalogued under the topic Chip carriers.
Its subject is documented across 17 Wikipedia language editions.
Wikidata facts
- Instance of
- integrated circuit packaging type
- Subclass of
- semiconductor package
- Image
- Yakumo Notebook 536S - ITE IT8705F-7140.jpg
Show 1 more fact
- Commons category
- QFP integrated circuit packages
Sources (1)
via Wikidata · CC0
Article · 日本語
QFP（英: quad flat package）は電気部品の半導体のパッケージの一種である。 主に外形は四角形で、4辺から端子がつき出しており、プリント配線板の表面にはんだ付けされる。
Abstract from DBpedia / Wikipedia · CC BY-SA
Connections
dual in-line package
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surface-mount technology
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through-hole technology
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chip carrier
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small-outline integrated circuit
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integrated circuit packaging type
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