Semiconductor device fabrication

intentional introduction of impurities into an intrinsic semiconductor for the purpose of modulating its electrical properties

thin slice of semiconductor material used in the fabrication of integrated circuits

320px|thumb|right| Entrance to a cleanroom with no air shower thumb|right| Cleanroom used for the production of microsystems. The yellow (red-green) lighting is necessary for [[photolithography, to prevent unwanted exposure of photoresist to light of shorter wavelengths.]] thumb|right| Cleanroom from outside thumb|right| Cleanroom for microelectronics manufacturing with [[fan filter units installed in the ceiling grid]] thumb|right| Cleanroom cabin for precision measuring tools thumb| Typical cleanroom head garment

Microtechnology is technology whose features have dimensions of the order of one micrometre (one millionth of a metre, or 10−6 metre, or 1μm). It focuses on physical and chemical processes as well as the production or manipulation of structures with one-micrometre magnitude.

process used to make thin films for semiconductors or surface coating

physico-chemical processes contributing to protect a surface against oxidation

manufacturing process used to create integrated circuits

a compound for coating metals

synthetic resin made by copolymerizing phenol and formaldehyde

Epitaxy (prefix epi- means "on top of") is a type of crystal growth or material deposition in which new crystalline layers are formed with one or more well-defined orientations with respect to the crystalline seed layer. The deposited crystalline film is called an epitaxial film or epitaxial layer. The relative orientation(s) of the epitaxial layer to the seed layer is defined in terms of the orientation of the crystal lattice of each material. For most epitaxial growths, the new layer is usually crystalline and each crystallographic domain of the overlayer must have a well-defined orientation

term in physics

material and chemical process

semiconductor manufacturing process

method of producing thin films (polycrystalline and single crystal)

Thin-film deposition technique

technique used to connect a microchip to its package

device

process used to make microchips

factory where devices such as integrated circuits are manufactured

Chinese electrical engineer

final stage of semiconductor device fabrication

Industrial procedure

right|thumb|Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades, microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese

business model separating semiconductor fabrication from design

technique in microfabrication

reusable unit of integrated circuit design that can be licensed to other chip designers

polishing technique used during semiconductor fabrication

method of thin film application

non-rectifying electrical junction: a junction between two conductors that has a linear current–voltage (I-V) curve as with Ohm's law

Ultra thin coating process

metal-plated holes used to vertically electrically connect several dies that are atop each other

integrated circuit packaging method

physical vapor deposition technique using a high-power pulsed laser beam in a vacuum chamber

controlled material removal, without the use of liquid substances

water purified to uncommonly stringent specifications

Tetrakis(dimethylamino)titanium (TDMAT), also known as Titanium(IV) dimethylamide, is a chemical compound. The compound is generally classified as a metalorganic species, meaning that its properties are strongly influenced by the organic ligands but the compound lacks metal-carbon bonds. It is used in chemical vapor deposition to prepare titanium nitride (TiN) surfaces and in atomic layer deposition as a titanium dioxide precursor. The prefix "tetrakis" refers the presence of four of the same ligand, in this case dimethylamides.

integrated circuit with vertical interconnections

deposition

beam of charged atoms (ions)

standard set of wafer cleaning steps which need to be performed before high-temperature processing steps of silicon wafers in semiconductor manufacturing

thumb|250px|An Mercury-vapor lamp#Emission line spectrum|i-line stepper at [[Cornell NanoScale Science and Technology Facility. (Photo taken under inactinic light.)]]

industrial process

highly anisotropic etch process

1st part of IC fabrication that patterns individual devices in the semiconductor

the 2nd portion of IC fabrication where the individual devices are connected with wiring on the wafer

thumb|300 px|Segment of novolak, illustrating the predominance of cresol subunits and presence of Cross-link|crosslinking. Novolaks (sometimes: novolacs) are low molecular weight polymers derived from phenols and formaldehyde. They are related to Bakelite, which is more highly crosslinked. The term comes from Swedish "lack" for lacquer and Latin "novo" for new, since these materials were envisioned to replace natural lacquers such as copal resin.

integrated circuit

mathematical model of semiconductor oxidation

step performed during semiconductor device fabrication by applying special test patterns to a wafer before it is sent to die preparation

the process by which die are separated from a wafer of semiconductor following the processing of the wafer

Chinese chip factories

The term salicide refers to a technology used in the microelectronics industry used to form electrical contacts between the semiconductor device and the supporting interconnect structure. The salicide process involves the reaction of a metal thin film with silicon in the active regions of the device, ultimately forming a metal silicide contact through a series of annealing and/or etch processes. The term "salicide" is a compaction of the phrase self-aligned silicide. The description "self-aligned" suggests that the contact formation does not require photolithography patterning processes, as op

technique for characterizing semiconductor materials and devices

Equipment Under Test

set of files for building chips for a specific technology (90 nm, 65 nm, and 45 nm) for a specific foundry

FOUP (an acronym for front-opening unified pod or front-opening universal pod) is a specialized plastic carrier designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement.

type of company which designs, manufactures, and sells its own integrated circuits

thin layer (usually micrometres thick) of metal usually placed between two other metals

quickly heats semiconductor wafers to high temperatures